Linking microstructure and high-frequency electrical performance in low-temperature SnBiIn-based solders for advanced packaging

Basem Abu Zneid, Firas Badri Abed, Ashutosh Pattanaik, Binayak Pattanayak, Ashwin Jacob, Ripendeep Singh, Yashwant Singh Bisht

Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications

Published online on January 28, 2026

Abstract

Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications, Ahead of Print.
The present study evaluates the microstructural development and GHz electrical response of two solder systems: a multicomponent SnBiInZnAg (SBIZA) alloy and a ternary SnBiIn alloy. Microstructural analysis revealed that SBIZA joints formed an ...