Investigation on microstructure evolution and mechanical reliability of Sn-Ni high-temperature resistant solder joints fabricated through microwave hybrid heating
Published online on February 04, 2026
Abstract
Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications, Ahead of Print.
In this study, microwave hybrid heating (MHH) technique was used to prepare full intermetallic compound (IMC) joints. The microstructure evolution, mechanical properties, and fracture mechanisms of the Sn-xNi(x = 10, 20, 30 wt.%) reaction were ...
In this study, microwave hybrid heating (MHH) technique was used to prepare full intermetallic compound (IMC) joints. The microstructure evolution, mechanical properties, and fracture mechanisms of the Sn-xNi(x = 10, 20, 30 wt.%) reaction were ...