Prediction of creep mechanical properties and bonded ratio curves in diffusion bonding using finite element-based void closure models and optimized deep learning techniques
Published online on February 19, 2026
Abstract
Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications, Ahead of Print.
A void closure analytical model for the diffusion bonding of titanium TC4 alloy is developed in this study, in which an FEA-based deformation mechanism was coupled with the numerical analysis for diffusion. The focus was on evaluating the effect of ...
A void closure analytical model for the diffusion bonding of titanium TC4 alloy is developed in this study, in which an FEA-based deformation mechanism was coupled with the numerical analysis for diffusion. The focus was on evaluating the effect of ...