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Optimizing thickness uniformity in double-pulse nickel electroforming via a physics-guided COMSOL®–ANN–WOA framework

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Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering

Published online on

Abstract

Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, Ahead of Print.
The thickness uniformity of electroformed layers critically determines the dimensional accuracy, surface quality, and reliability of micro-electroformed devices. This work investigates nickel deposition under double-pulse current with a focus on ...