Optimizing thickness uniformity in double-pulse nickel electroforming via a physics-guided COMSOL®–ANN–WOA framework
Published online on February 09, 2026
Abstract
Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, Ahead of Print.
The thickness uniformity of electroformed layers critically determines the dimensional accuracy, surface quality, and reliability of micro-electroformed devices. This work investigates nickel deposition under double-pulse current with a focus on ...
The thickness uniformity of electroformed layers critically determines the dimensional accuracy, surface quality, and reliability of micro-electroformed devices. This work investigates nickel deposition under double-pulse current with a focus on ...