A 2D numerical study of magnetohydrodynamic heat transfer performance within heat sink package equipped with cylindrical fins improved with helical trapezoidal wings and filled by radiative nanofluid
Published online on September 30, 2024
Abstract
Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, Ahead of Print.
Cooling electronic devices using heat sinks is one of the main fields in which academics are working to develop them. This manuscript presents a novel numerical study using Comsol Multiphysics to optimize heat sink performance through the strategic ...
Cooling electronic devices using heat sinks is one of the main fields in which academics are working to develop them. This manuscript presents a novel numerical study using Comsol Multiphysics to optimize heat sink performance through the strategic ...