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Particle tracking-based in-situ computed tomography measurement technique for advanced analytics of adhesive bonds

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Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering

Published online on

Abstract

Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, Ahead of Print.
In the application field of adhesive bonding technology, the use of in-situ computed tomography (CT) opens up possibilities for detecting processes inside bonds that were hidden thus far. The present paper presents a successfully applied in-situ CT ...