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Low residual vibration method at the end of picking arm based on fifth-order motion curve planning

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Journal of Vibration and Control

Published online on

Abstract

Journal of Vibration and Control, Volume 32, Issue 9-10, Page 2193-2209, May 2026.
Achieving high efficiency packaging under the premise of high precision is the goal pursued by the semiconductor packaging industry. The high-velocity and stable motion plays an important role in improving the efficiency and accuracy of chips patch. ...