Low residual vibration method at the end of picking arm based on fifth-order motion curve planning
Journal of Vibration and Control
Published online on March 25, 2025
Abstract
Journal of Vibration and Control, Volume 32, Issue 9-10, Page 2193-2209, May 2026.
Achieving high efficiency packaging under the premise of high precision is the goal pursued by the semiconductor packaging industry. The high-velocity and stable motion plays an important role in improving the efficiency and accuracy of chips patch. ...
Achieving high efficiency packaging under the premise of high precision is the goal pursued by the semiconductor packaging industry. The high-velocity and stable motion plays an important role in improving the efficiency and accuracy of chips patch. ...